Hong Kong Monetary Authority Announces 20-Year Bond Tender for March 2025

The Hong Kong Monetary Authority (HKMA), representing the Hong Kong Special Administrative Region (HKSAR) Government, has announced a tender for 20-year HKD Institutional Government Bonds. Scheduled for March 5, 2025, this tender is part of the Infrastructure Bond Programme, with settlement set for March 6, 2025, according to the Hong Kong Monetary Authority.

Tender Details

The tender will offer HK$0.5 billion in bonds, maturing on March 6, 2045, with an interest rate of 3.99% per annum, payable semi-annually. Only Primary Dealers listed under the Infrastructure Bond Programme can participate. Application through a Primary Dealer is mandatory, with each tender requiring a minimum amount of HK$50,000 or multiples thereof.

Publication of Tender Results

The results of the tender will be made available on the HKMA’s website, the Hong Kong Government Bonds site, Bloomberg, and Refinitiv by 3:00 pm on the tender day.

Bond Specifications

Designated as issue number 20GB4503001, the bonds carry the stock code 4290 (HKGB 3.99 4503). The tender will take place from 9:30 am to 10:30 am on March 5, 2025. Interest payments are scheduled for March 6 and September 6 annually, contingent on terms outlined in the Information Memorandum on the Hong Kong Government Bonds website.

Infrastructure Investment

The proceeds from these bonds will support infrastructure projects under the Infrastructure Bond Framework. Trading on the Stock Exchange of Hong Kong Limited is expected to commence on March 7, 2025.

This strategic issuance underscores Hong Kong's commitment to bolstering its infrastructure through sustainable financial mechanisms, offering investors a stable long-term investment option.